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Logo Made in Germany SEMICON Japan 2017

Finetech GmbH & Co. KG

Booth number: 1609-6

www.finetech.de
finetech@finetech.de

About us

Finetech is a leading equipment manufacturer for sub-micron die bonding and advanced die packaging. Along with manual and semi-automated die bonders for quick product development, the company offers micro assembly platforms for fully-automated production environments.

Finetech helps technology start-ups and industry leaders worldwide to develop and manufacture innovative semiconductor products. It responds flexibly to specific requirements and offers tailor-made solutions to highly-demanding customer applications.

Served customers are companies e.g. in the fields of data communication, medical technologies, automotive, aerospace, defense & security, universities and research organizations.

Finetech is headquartered in Berlin, Germany, with additional sales & service centers in Japan, USA, China, and Malaysia.


Products and services

FINEPLACER<sup>®</sup> lambda - Flexible Sub-micron Die Bonder

FINEPLACER® lambda - Flexible Sub-micron Die Bonder

The FINEPLACER® lambda offers a modular design and can be easily reconfigured for future applications, making it the premier choice when maximum technological versatility and fast process implementation is key. Typical fields of application include R&D, prototyping and low-volume production.

The system handles a wide range of applications, including laser bar and diode bonding with Indium or Au/Sn, VCSEL/PD bonding and MEMS/MOEMS assembly for communication and medical technology products.

FINEPLACER<sup>®</sup> femto 2 - Automated Prototype2Production Bonder

FINEPLACER® femto 2 - Automated Prototype2Production Bonder

The fully-automated FINEPLACER® femto 2 has a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment. Protected from external influences, the system ensures highly stable assembly processes.

The micro assembly platform can be individually configured and retrofitted at any time to support new applications and technologies. This makes it the perfect tool as applications migrate from product development to production.

FINEPLACER<sup>®</sup>sigma - Semi-automated Sub-Micron Bonder

FINEPLACER®sigma - Semi-automated Sub-Micron Bonder

The FINEPLACER® sigma combines sub-micron placement accuracy with a large working area and bonding forces up to 1000 N. The system is ideal for all types of precision die bonding and flip chip applications at chip and wafer level, including 2.5D and 3D IC packages, FPA (i.e. image sensors), or MEMS/MOEMS.

The system is capable of handling a wide spectrum of applications and supports numerous state-of-the-art technologies, including vacuum die bonding, sintering, and laser-assisted die bonding.

Contacts

Address
Finetech GmbH & Co. KG
Boxberger Str. 14
12681 Berlin
Germany

Phone: +49 30 936681-0
Fax: +49 30 936681-144

Kotaro Iida
General Manager, Finetech Nippon Co., Ltd.
Phone: +81 3596 2084
kotaro.iida@finetech-nippon.co.jp

Representative
Finetech Nippon Co., Ltd.
2nd Haruno Building 1F
6-23-2 Nishi-Kamata Ohta-ku, Tokyo 144-0051
Japan

Phone: +81 50 35962084
Fax: +81 50 37302666

request@finetech-nippon.co.jp
www.finetech-nippon.co.jp



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