FINEPLACER® lambda - Flexible Sub-micron Die Bonder
The FINEPLACER® lambda offers a modular design and can be easily reconfigured for future applications, making it the premier choice when maximum technological versatility and fast process implementation is key. Typical fields of application include R&D, prototyping and low-volume production.
The system handles a wide range of applications, including laser bar and diode bonding with Indium or Au/Sn, VCSEL/PD bonding and MEMS/MOEMS assembly for communication and medical technology products.
FINEPLACER® femto 2 - Automated Prototype2Production Bonder
The fully-automated FINEPLACER® femto 2 has a placement accuracy of 0.5 µm @ 3 sigma. A complete machine enclosure allows very demanding applications in a controlled environment. Protected from external influences, the system ensures highly stable assembly processes.
The micro assembly platform can be individually configured and retrofitted at any time to support new applications and technologies. This makes it the perfect tool as applications migrate from product development to production.
FINEPLACER®sigma - Semi-automated Sub-Micron Bonder
The FINEPLACER® sigma combines sub-micron placement accuracy with a large working area and bonding forces up to 1000 N. The system is ideal for all types of precision die bonding and flip chip applications at chip and wafer level, including 2.5D and 3D IC packages, FPA (i.e. image sensors), or MEMS/MOEMS.
The system is capable of handling a wide spectrum of applications and supports numerous state-of-the-art technologies, including vacuum die bonding, sintering, and laser-assisted die bonding.
Finetech GmbH & Co. KG
Boxberger Str. 14
Phone: +49 30 936681-0
Fax: +49 30 936681-144
Finetech Nippon Co., Ltd.
2nd Haruno Building 1F
6-23-2 Nishi-Kamata Ohta-ku, Tokyo 144-0051
Phone: +81 50 35962084
Fax: +81 50 37302666
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