UniTemp Germany was founded in 2000. Our main focus is the development of high precision and high temperature (up to 1200 °C) process equipment with very fast ramp up rates (up to 150 K/second). Our customers are located in the semiconductor industry and R&D. We also focused on customer specific solutions.
VPO-1000-300 Vacuum Process Oven
The UniTemp VPO-1000-300 Oven is a compact solution for processing up to 300 mm wafer size and up to 1000 °C (optionally up to 1200 °C). Excellent ramp up and ramp down rates are guaranteed by double crossed IR lamp fields and cooling by gas. A lift pin version and a remote control system is also available as well as the option for connecting a robotics system.
RTP-100 Rapid Thermal Annealing oven
Our RTP oven series is a single wafer process development tool for up to 1200°C. Optionally up to vacuum up to 10E-6 hPa. Up to 150 mm wafer size. The oven is SIMATIC controlled and can be easily used by a touch panel system.
This system is like a table top system.
WB-200 Wire Bonder
The WB-200 is a perfect tool for laboratory use and small series. It allows an easy tool change from wedge to ball bonding. For wire from 17-50µ (gold or aluminium). Key feature is the 3 motorized axis (X, Y and Z). The Z-axis is mouse controlled. For the options we offer different solutions depending on the customers demand and application.
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Phone: +49 8441 787663
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