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Fraunhofer-Institut fuer Zuverlaessigkeit und Mikrointegration IZM - ASSID

ブース番号: 1609-7


Fraunhofer IZMs center “All Silicon System Integration Dresden – ASSID” operates a leading edge, industry-compatible 200/300 mm 3D wafer-level process line with modules for TSV formation, pre-assembly (thinning, singulation), wafer-level assembly and stack Formation. ASSID is focusing on process development, material and equipment evaluation as well as R&D services. It is a partner in national, European and worldwide industrial and scientific projects and networks for 3D system integration, e. g., HIR, HTA, ENIAC JU, Catrene, EPOSS, SEMATECH and the Silicon Saxony Network. Fraunhofer IZM-ASSID has established cooperation and joint development programs with industrial partners for undertaking material and equipment evaluation, process development as well as process and product integration.


Customer Services
Technological services include:

  • Customer-specific prototyping (WL-SiP, TSV interposer) and pilot line manufacturing
  • Material and equipment evaluation, process development, process transfer and product integration
  • TSV silicon interposer 
  • 3D TSV via middle/via last process integration
  • Deposition & patterning of dielectric polymers and metal films
  • Multi-layer Cu redistribution with customer-specific terminal pad metallurgies (Cu, Cu/Ni/Au, Cu/SnAg)
  • Wafer thinning and thin wafer processing
  • ECD WL bumping (Cu-Pillar, SnAg, CuNiAu)
  • WL assembly (D2W, W2W)


Fraunhofer-Institut fuer Zuverlaessigkeit und Mikrointegration IZM - ASSID
Ringstr. 12
01468 Moritzburg OT Boxdorf

電話: +49 351 79557212
ファックス: +49 351 79557219

M. Juergen Wolf
Head of WLSI / Head of Fraunhofer IZM-ASSID

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